35g Lead-Free Solder Paste For Electronics 138 ℃ Melting Point Sn42 Bi58 with Syringe - Low Residue Solder Cream for BGA and PCB Reflow
No.35G-138Sn42Bi58
Composition: Sn=42%, Bi=58% Lead-free, Pb-free Melting Point: 138℃ Microns: 20~38um Suitable for the special soldering of heat-sensitive PCB boards and small components Net Weight: 35g/Syringe (Tube) Gross Weight:45g
