Images are for reference only. We will deliver products marked with the latest production date when shipping.
Features:Kingbo RMA-218 100g is a high-viscosity no-clean flux that can be used for rework, fixing balls or pins on for BGA, CGA and CSP packages, and for mounting flip-chips on PWB substrates.
A good formulation of for BGA ball/ball can make the ball more adherent.
It can be refluxed in hot air, infrared, oven or nitrogen environment. After reflow, 100 grams of Kingbo RMA-218 flux can leave bright solder joints.
High viscosity value and long viscosity life.
