Leaded Solder Paste Sn62.8 Pb36.8 Ag 0.4 181℃ Melting Point 35g Tin Solder Scream With Syringe And Needle- Low Residue Solder Cream for BGA and PCB Reflow
Features:
High versatility
High electrical conductivity
Strong soldering joint
Bright solder joints
Applications:
Suitable for soldering of fine-pitch ICs, BGA solder ball planting in mobile phone repair, and soldering of various high-demand circuit boards
• Rotate counterclockwise to remove the syringe cap.
• Rotate clockwise to attach the needle.
• Smooth extrusion
• Fine texture
• Produced with professional formula
• Vacuum automatic mixing
