Description
NC-559-ASM No-Clean Solder Paste, Solder Flux Soldering Flux Grease 10cc for BGA PCB Chip Soldering Rework Repair
Features
This NC-559-ASM no-clean solder paste is a high-viscosity soldering flux, ideal for PCB and SMD rework. It supports soldering and BGA reballing for mobile phone, computer IC chips, and is an essential supply for motherboard repair.
Formulated with premium alloy powder and resin flux, this solder flux leaves faint pale residues for easy board cleaning. It effectively assists circuit board rework and protects sensitive electronic components during soldering.
Product Application
Suitable for sensors, wires, motors, safety tubes, connectors, metal housings, lighting parts and electronic components. Widely used in SMT maintenance, BGA & CSP chip reballing and rework.
NC-559-ASM is a wash-free solder paste with low visible residue and high SIR value, specially recommended for BGA, CSP and other ball grid array solder joint repair.
Specifications
• Housing Material: ABS
• Compound: Solder grease / ointment
• Type: No-clean (Wash-free)
• Volume: 10cc
• Net Weight: 20g
• Size: 1003323mm / 3.941.30.91 inch
Notes
1. The actual color may differ slightly from the pictures due to different screen displays and lighting.
2. Minor measurement errors may exist because of manual measurement.
