Semi-automatic Optical Align BGA Rework Station Reballing Machine 5300W Desoldering Soldering Station BGA Rework Equipment
No.18000ZS240423
Rated Capacity:MAX 5300W Dimensions:L650*W630*H850mm Available BGA Chip:Max 70*70mm Min 1*1 mm Available PCB size:Max 410*380mm Min 10*10 mm Contact us for price list: E-mail: zhiesync@gmail.com What'sApp : 0086 18665889453
Semi-automatic Optical Align BGA Rework Station Reballing Machine 5300W Desoldering Soldering Station BGA Rework Equipment
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Country/Region of Manufacture: China
Voltage:110V/220V
Rated Capacity:MAX 5300W
Dimensions:L650*W630*H850mm
Rated Duty Cycle:50-100%
Net Weight:60kg
Gross Weight: 110KG (1 wooden box)
Package Size: 88*68*87cm
Usage: BGA Reballing ,repair motherboard
Available BGA Chip:Max 70*70mm Min 1*1 mm
Available PCB size:Max 410*380mm Min 10*10 mm
Temperature control: Hot Air +infrared
Feature: Semi-automatic Optical Align BGA Rework Station
Warranty:1 Year
