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Home > Soldering Consumables > Tin Solder Paste > Solder Paste Sn64.7 Ag0.3 Bi35 Lead-Free 151 ℃ Melting Point 35g Tin Solder Scream With Syringe

Solder Paste Sn64.7 Ag0.3 Bi35 Lead-Free 151 ℃ Melting Point 35g Tin Solder Scream With Syringe

No.35G-151Sn64.7Ag0.3Bi35

Composition: Sn=64.7%, Ag=0.3%, Bi=35% Lead-free, Pb-free, silver-containing Melting Point: 151℃ Microns: 20~38um Net Weight: 35g/Syringe (Tube) Gross Weight:45g Suitable for the special soldering of heat-sensitive PCB boards and small components

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Description

Solder Paste Sn64.7 Ag0.3 Bi35 Lead-Free 151 ℃ Melting Point 35g Tin Solder Scream With Syringe - Low Residue Solder Cream for BGA and PCB Reflow

Composition: Sn=64.7%, Ag=0.3%, Bi=35%
Lead-free, Pb-free, silver-containing
Melting Point: 151℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g

Features:
Lead-free silver-containing
High versatility
High electrical conductivity
Strong soldering joint

Applications
Suitable for the special soldering of
heat-sensitive PCB boards and small components

• Rotate counterclockwise to remove the syringe cap.

• Rotate clockwise to attach the needle.

•   Smooth extrusion
•   Fine texture
•   Produced with professional formula
•   Vacuum automatic mixing

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