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Home > Soldering Consumables > Tin Solder Paste > Solder Paste Sn96.5 Ag3.0 Cu0.5 Lead-Free 217 ℃ Melting Point 35g Tin Solder Scream With Syringe

Solder Paste Sn96.5 Ag3.0 Cu0.5 Lead-Free 217 ℃ Melting Point 35g Tin Solder Scream With Syringe

No.35G-217Sn96.5 Ag3.0 Cu0.5

Composition: Sn=96.5%, Ag=3.0%, Cu=0.5% Lead-free, Pb-free, silver-containing Melting Point: 217℃ Microns: 20~38um Net Weight: 35g/Syringe (Tube) Gross Weight:45g Suitable for soldering of fine-pitch ICs and various high-demand circuit boards

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Description

Solder Paste Sn96.5 Ag3.0 Cu0.5 Lead-Free 217 ℃ Melting Point 35g Tin Solder Scream With Syringe - Low Residue Solder Cream for BGA and PCB Reflow

Composition: Sn=96.5%, Ag=3.0%, Cu=0.5%
Lead-free, Pb-free, silver-containing
Melting Point: 217℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g

Features:
Strong soldering joint
High electrical conductivity
Strong oxidation resistance

Applications:
Suitable for soldering of fine-pitch ICs and various high-demand circuit boards

• Rotate counterclockwise to remove the syringe cap.

• Rotate clockwise to attach the needle.

•   Smooth extrusion
•   Fine texture
•   Produced with professional formula
•   Vacuum automatic mixing

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